Tag: IC Substrate

SUPERB provides advanced multilayer high-speed IC package substrate PCB solutions for 5G RF antenna modules, main-frequency power modules and high-frequency processor IC packaging. Featuring multi-layer, multi-step any-layer interconnection technolog

Advanced Multi-Layer BGA Package Substrate for CPU, Power Module and Processor IC Applications. With the rapid development of semiconductor technology, traditional PCB solutions cannot meet the requirements of high-density chip packaging. IC Package

High-Density Interconnect (HDI) PCBs use laser-drilled micro-vias — as small as 0.05 mm — to connect layers at far higher density than conventional through-hole vias. Superb Automation manufactures HDI boards up to 30-layer ELIC (Every Layer Intercon

High-precision IC carrier board with 132 Au wire-bond fingers, 144 solder ball pads, and center die-attach thermal pad — achieving CPK 4.08 on gold finger width.

Advanced HDI (High-Density Interconnect) extends beyond standard multi-layer PCB fabrication by incorporating laser-drilled micro-vias, sequential lamination build-up layers, and fine-line trace/space geometries below 4/4 mil. Where a standard throug